MEMS Wind Direction Detection: From Design to Operation
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Author(s)
Adamec, RJ
Thiel, DV
Tanner, P
Year published
2003
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A multi-axis hotwire anemometer fabricated with bulk micro-machining and thin film semiconductor technologies is presented. Extending the operation of a single axis anemometer into 2 axes allows direction sensing over the full 0࠭ 360࠷hile maintaining the original ability to measure flow velocity via the forced convection heat loss. Eliminating separate heating and sensing elements and combining both functions into single element pairs provides a means of lowering the temperature and power requirements and reducing size and fabrication complexity of the sensor compared to previously seen designs. CAD and modeling have aided ...
View more >A multi-axis hotwire anemometer fabricated with bulk micro-machining and thin film semiconductor technologies is presented. Extending the operation of a single axis anemometer into 2 axes allows direction sensing over the full 0࠭ 360࠷hile maintaining the original ability to measure flow velocity via the forced convection heat loss. Eliminating separate heating and sensing elements and combining both functions into single element pairs provides a means of lowering the temperature and power requirements and reducing size and fabrication complexity of the sensor compared to previously seen designs. CAD and modeling have aided in preparation of a suitable design to be fabricated in house using primarily photolithography and wet chemical etching. Successful wind tunnel trials have paved the way for field-testing and a commercially realizable sensor.
View less >
View more >A multi-axis hotwire anemometer fabricated with bulk micro-machining and thin film semiconductor technologies is presented. Extending the operation of a single axis anemometer into 2 axes allows direction sensing over the full 0࠭ 360࠷hile maintaining the original ability to measure flow velocity via the forced convection heat loss. Eliminating separate heating and sensing elements and combining both functions into single element pairs provides a means of lowering the temperature and power requirements and reducing size and fabrication complexity of the sensor compared to previously seen designs. CAD and modeling have aided in preparation of a suitable design to be fabricated in house using primarily photolithography and wet chemical etching. Successful wind tunnel trials have paved the way for field-testing and a commercially realizable sensor.
View less >
Conference Title
PROCEEDINGS OF THE IEEE SENSORS 2003, VOLS 1 AND 2
Volume
2
Issue
1
Publisher URI
Copyright Statement
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