Plastic circuit reliability and design for recycling

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Title Plastic circuit reliability and design for recycling
Author Thiel, David Victor; Neeli, Madhusudanrao; Raj, Sundra
Publication Title Electronics Packaging Technology Conference
Editor Yoon, S.Y.
Year Published 2009
Place of publication Piscataway, N.J. USA
Publisher IEEE Press
Abstract Electronics is a major contributor to solid waste streams around the world. The manufacturing and the recycling processes currently used in the electronics industry are energy intensive and are accompanied by noxious gaseous and liquid waste. Circuits in Plastic (CiP) is a new technology designed to address issues. Circuit components are placed in a plastic substrate, conductive tracks are screen printed and the completed completed by thermally binding a cover sheet of the same material. The circuits are disassembled by mechanical means. While the process requires much less energy and produces minimal waste, the process must be reliable. Mechanical experiments and thermal modeling have supported the viability of the technology. Microcontroller circuits manufactured in this way have remained functional over 4 years and a water proof and mechanically reliable.
Peer Reviewed Yes
Published Yes
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Copyright Statement Copyright 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
ISBN 978-1-4244-5100-5
Conference name 11th Electronic Packaging Technology Conference 2009
Location Singapore
Date From 2009-12-09
Date To 2009-12-11
Date Accessioned 2009-12-24
Language en_AU
Faculty Faculty of Science, Environment, Engineering and Technology
Subject Circuits and Systems; Environmental Engineering Design
Publication Type Conference Publications (Full Written Paper - Refereed)
Publication Type Code e1

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