Upgraded EMC Modelling of Dual Die Structure

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Title Upgraded EMC Modelling of Dual Die Structure
Author Zhu, Boyuan; Lu, Junwei; Stegen, Sascha
Publication Title Electromagnetic Compatibility Symposium Adelaide 2009
Editor Paul Kay
Year Published 2009
Place of publication Los Alamitos, CA
Publisher IEEE
Abstract Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided.
Peer Reviewed Yes
Published Yes
Alternative URI http://dx.doi.org/10.1109/EMCSA.2009.5349765
Copyright Statement Copyright 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
ISBN 978-1-4244-4675-9
Conference name Electromagnetic Compatibility Symposium Adelaide 2009
Location Adelaide
Date From 2009-09-16
Date To 2009-09-18
URI http://hdl.handle.net/10072/29989
Date Accessioned 2010-03-03
Language en_AU
Research Centre Queensland Micro and Nanotechnology Centre
Faculty Faculty of Science, Environment, Engineering and Technology
Subject Electrical and Electronic Engineering
Publication Type Conference Publications (Full Written Paper - Refereed)
Publication Type Code e1

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