Upgraded EMC Modelling of Dual Die Structure
| File | Size | Format | |
|---|---|---|---|
| 60759_1.pdf | 2226Kb | Adobe PDF | View |
| Title | Upgraded EMC Modelling of Dual Die Structure |
|---|---|
| Author | Zhu, Boyuan; Lu, Junwei; Stegen, Sascha |
| Publication Title | Electromagnetic Compatibility Symposium Adelaide 2009 |
| Editor | Paul Kay |
| Year Published | 2009 |
| Place of publication | Los Alamitos, CA |
| Publisher | IEEE |
| Abstract | Due to the variety of internal structures applied in different processors, EMC modelling should also be upgraded correspondingly. This paper presents an upgraded EMC simulation model of dual die structure which is originated from the IEEE electromagnetic challenging problem 2000-4 for conventional CPU with heatsink. The simulation results are verified by measurement with a fabricated model. Furthermore, a consequent benchmark will be provided. |
| Peer Reviewed | Yes |
| Published | Yes |
| Alternative URI | http://dx.doi.org/10.1109/EMCSA.2009.5349765 |
| Copyright Statement | Copyright 2009 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE. |
| ISBN | 978-1-4244-4675-9 |
| Conference name | Electromagnetic Compatibility Symposium Adelaide 2009 |
| Location | Adelaide |
| Date From | 2009-09-16 |
| Date To | 2009-09-18 |
| URI | http://hdl.handle.net/10072/29989 |
| Date Accessioned | 2010-03-03 |
| Date Available | 2010-06-03T09:03:02Z |
| Language | en_AU |
| Research Centre | Centre for Wireless Monitoring and Applications |
| Faculty | Faculty of Science, Environment, Engineering and Technology |
| Subject | Electrical and Electronic Engineering |
| Publication Type | Conference Publications (Full Written Paper - Refereed) |
| Publication Type Code | e1 |
Please use this identifier to cite this record: http://hdl.handle.net/10072/29989
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