EMC Modelling of Dual Die CPU with a Heatsink

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Title EMC Modelling of Dual Die CPU with a Heatsink
Author Zhu, Boyuan; Lu, Junwei; Li, Erping
Publication Title Proceedings of IEEE APEMC2010
Editor Jing Liang HE
Year Published 2010
Place of publication Beijing
Publisher IEEE
Abstract This paper presents an EMC modelling approach for the latest dual die CPU with a heatsink from an antenna point of view. The model acts as a very efficient antenna while its structure is constructed almost according to a real dual die CPU structure. Different sizes of heatsink cooperate in the investigation of electromagnetic characterization. Simulation and measurement are accomplished in far-filed range. The results show that the dual die model without heatsink is resonating at two frequencies which are 2.04GHz and 4.9GHz. When a heatsink is mounted however the resonant frequencies are changed to 1.80GHz and 5.20GHz respectively.
Peer Reviewed Yes
Published Yes
Alternative URI http://dx.doi.org/10.1109/APEMC.2010.5475514
Copyright Statement Copyright 2010 IEEE. Personal use of this material is permitted. However, permission to reprint/republish this material for advertising or promotional purposes or for creating new collective works for resale or redistribution to servers or lists, or to reuse any copyrighted component of this work in other works must be obtained from the IEEE.
ISBN 978-1-4244-5621-5
Conference name IEEE APEMC2010
Location Beijing
Date From 2010-04-12
Date To 2010-04-16
URI http://hdl.handle.net/10072/37283
Date Accessioned 2011-01-25
Date Available 2011-03-16T07:56:12Z
Language en_AU
Research Centre Centre for Wireless Monitoring and Applications; Queensland Micro and Nanotechnology Centre
Faculty Faculty of Science, Environment, Engineering and Technology
Subject Electrical and Electronic Engineering
Publication Type Conference Publications (Full Written Paper - Refereed)
Publication Type Code e1

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