Electromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPU

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Title Electromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPU
Author Zhu, Boyuan; Lu, Junwei; Li, Erping
Year Published 2011
Publisher IEEE
Citation IEEE Transactions on Electromagnetic Compatibility, Vol. 53(1), pp. 91-98
Peer Reviewed Yes
Published Yes
Alternative URI http://dx.doi.org/10.1109/TEMC.2010.2053208
Research Centre Centre for Wireless Monitoring and Applications; Queensland Micro and Nanotechnology Centre
Faculty Faculty of Science, Environment, Engineering and Technology
Publication Type Journal Articles (Refereed Article)

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