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Electromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPU

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Title Electromagnetic Compatibility Benchmark-Modeling Approach for a Dual-Die CPU
Author Zhu, Boyuan; Lu, Junwei; Li, Erping
Journal Name IEEE Transactions on Electromagnetic Compatibility
Year Published 2011
Place of publication United States
Publisher IEEE
Abstract Abstract—The traditional challenging problem 2000-4 of electromagnetics (as indicated by the IEEE) proposed a benchmark model of a conventional CPU with a heatsink. However, after CPU entered the multiple-die century, the original model is no longer effective for the new generation multiple-die package. A novel model is proposed in this paper for electromagnet radiation modeling of the CPU with dual dies as a new electromagnetic compatibility benchmark-modeling approach. Themodeling method is validated by the measurement, and the simulation and measurement results showed a good agreement, and demonstrated it is an effective modeling technique.
Peer Reviewed Yes
Published Yes
Alternative URI http://dx.doi.org/10.1109/TEMC.2010.2053208
Volume 53
Issue Number 1
Page from 91
Page to 98
ISSN 0018-9375
Date Accessioned 2012-01-04; 2012-03-02T04:45:37Z
Date Available 2012-03-02T04:45:37Z
Research Centre Centre for Wireless Monitoring and Applications
Faculty Faculty of Science, Environment, Engineering and Technology
Subject Microelectronics and Integrated Circuits
URI http://hdl.handle.net/10072/43242
Publication Type Journal Articles (Refereed Article)
Publication Type Code c1

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