The Effect of Lamination on Printed Silver Tracks for Plastic Circuits
Author(s)
Neeli, MadhusudanRao
Thiel, David V
Griffith University Author(s)
Year published
2012
Metadata
Show full item recordAbstract
To combat the global e-waste crisis, there is an urgent need to develop a technology where environmental pollution from electronics, their manufacturing and product end of life is minimized through recycling and re-use. Circuits in Plastic (CiP) is electronic systems manufacturing technology that does not use traditional hazardous chemicals with cost and environmental advantages. This paper reports the effect of the hot lamination on different plastic materials including recycled and bioplastics, screen printed with silver ink. The use of a thermal lamination processing step forms the circuit connections and cures the screen ...
View more >To combat the global e-waste crisis, there is an urgent need to develop a technology where environmental pollution from electronics, their manufacturing and product end of life is minimized through recycling and re-use. Circuits in Plastic (CiP) is electronic systems manufacturing technology that does not use traditional hazardous chemicals with cost and environmental advantages. This paper reports the effect of the hot lamination on different plastic materials including recycled and bioplastics, screen printed with silver ink. The use of a thermal lamination processing step forms the circuit connections and cures the screen printed silver in one process. Many different plastic types can be used to form these circuits. These observations support previous life cycle assessment arguments that CiP has a lower environmental cost compared to traditional PCB circuit formation.
View less >
View more >To combat the global e-waste crisis, there is an urgent need to develop a technology where environmental pollution from electronics, their manufacturing and product end of life is minimized through recycling and re-use. Circuits in Plastic (CiP) is electronic systems manufacturing technology that does not use traditional hazardous chemicals with cost and environmental advantages. This paper reports the effect of the hot lamination on different plastic materials including recycled and bioplastics, screen printed with silver ink. The use of a thermal lamination processing step forms the circuit connections and cures the screen printed silver in one process. Many different plastic types can be used to form these circuits. These observations support previous life cycle assessment arguments that CiP has a lower environmental cost compared to traditional PCB circuit formation.
View less >
Conference Title
NANOTECHNOLOGY 2012, VOL 3: BIO SENSORS, INSTRUMENTS, MEDICAL, ENVIRONMENT AND ENERGY
Publisher URI
Subject
Circuits and systems